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IFE

3D-MC2B - 3D- Circuit board construction using polymer coatings on metal substrates and laser direct structuring for compact power electronics applications

Laufzeit
-
Projektleitung

The project deals with individually configurable circuit carriers and the resulting possibilities to place highly integrative electronics in complex and small installation spaces. The innovative approach is the use of powder-coated metal base bodies, which, among other things, have significantly better thermal properties with regard to heat management compared to the previous injection-molded plastics.

Project partners

Lenze SE
Weidmüller Interface GmbH & Co. KG

Project request

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